A pair of elements that I would like to ask to implement in future versions of TPT and the idea for the distant future.

===ASPK===
Anti SPRK. Works like SPRK, but there may be close to normal SPRK, and disappearing with SPRK on contact. Causes cooling of the material. If it is possible to implement, it has the opposite effect in interaction with NSCN and PSCN. Perhaps a new effect when interacting with ARAY. Rules are similar to the conductivity SPRK.

===EHET===
Special electric heater. When you activate through PSCN each SPRK increases the temperature of elements, such as PUMP, DLAY, GPMP and others on the value of its temperature. When activated by NSCN - each SPRK cools.

The idea of microchips. Make a special version of TPT, in which you can create special save - microassemblages. Each microassemblage have inputs (with properties PSCN), outputs (NSCN) and I / O (Metl). Inputs and outputs are made as WiFi - I / O with the same temperature SPRK transmit simultaneously. Microassemblage simulated only in simplified rules (without gravity, air and ambient heat).The created microchip has the size in normal TPT calculated based on the number of I / O. 5 pixels between the I / O for example. Simulation of a microchip works in a separate window with a base visualization without special effects. Internal size microassemblage less than the original work area 4-8 times.The number of micro assemblys can also be limited to 4-8. 

Besides the obvious compaction of schemes, this may help parallelize computations on the CPU

Thank you for the excellent "sandbox" and sorry for bad English.

Name wasn't important.

And why you call this powder Anti SPRK?

One more element idea for distant future.

===SPKR===

Speaker. When activated by SPRK makes a sound with a frequency depending on the temperature and duration of which depends on a parameter tmp or tmp2. Loudness or fixed or also linked with one of the parameters. Implementing this element will give other people possibility to do the sound mods, of which so much was said.

Sad. But ASPK and EHET wasn't Rejected, yet.

@Simon (View Post)

 Tungsten cant heat special element like DLAY  and other, electric colling -imposible.

I need conrolable PUMP, DLAY and other...

And ASPK can't be replaced by sprk, its potential ultimate method for compressing schemes. More complex and much faster electronic devices or new type of electronics can appear.