A single pixel of TTAN can stop pressure flowing any further, but the pressure blocking acts on a 4x4 pixel area. Pressure will not flow beyond this 4x4 pixel area, but may flow into this area. Watch this save in pressure view - the WIFI breaks before entering the sealed box of high pressure, since some high pressure is present all around the TTAN (sorry, forgot to use the stable version to make the save, you'll probably need to use the beta).

Therefore making the element block pressure like TTAN does won't necessarily be much smaller than using walls. We could try fiddling with the air simulation code to prevent air flowing into the 4x4 pixel blocked areas, but that's liable to be a bit of a minefield.

Blocking EMP - depends on how it works. Blocking EMP if there is any of this new element in a direct line between the EMP particle and the electronics is impractical for speed reasons, but protecting electronics within a certain radius (small, such as 3 pixels in all directions) might be okay.


DECR - I don't really see how it would be useful. Also, using heat and cool on things that aren't particles seems a bit clunky when you could just draw colours on, like you do for decorations.

The decorations layer actually used to work like this (decorations stayed in the same place regardless of particle movement, and covered particles), but was changed to work like it does now.


PDET - needs further explanation of exactly how it works. What exactly does it do in response to the number of particles present?

 

Property to make detectors detect less than instead of greater than - that might make it easier, but you can just use a not gate.